XCS204PQ208C

Product Summary

The XCS204PQ208C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. These requirements include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices. The XCS204PQ208C is the result of more than 14 years of FPGA design experience and feedback from thousands of customers. By streamlining the XCS204PQ208C features set, leveraging advanced process technologies and focusing on total cost management, the XCS204PQ208C delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs.

Parametrics

XCS204PQ208C absolute maximum ratings: (1)Supply voltage relative to GND:–0.5 to +7.0 V; (2)Input voltage relative to GND:–0.5 to VCC +0.5 V; (3)Voltage applied to 3-state output:–0.5 to VCC +0.5 V; (4)Storage temperature (ambient):–65 to +150℃; (5)Junction temperature:+125℃.

Features

XCS204PQ208C features: (1)Available in both 5V and 3.3V versions; (2)On-chip SelectRAM memory; (3)Fully PCI compliant; (4)Full readback capability for program verification and internal node observability; (5)Dedicated high-speed carry logic; (6)Internal 3-state bus capability; (7)Eight global low-skew clock or signal networks; (8)IEEE 1149.1-compatible Boundary Scan logic ; (9)Low cost plastic packages available in all densities; (10)Footprint compatibility in common packages; (11)3.3V supply for low power with 5V tolerant I/Os; (12)Power down input; (13)Higher performance; (14)Faster carry logic; (15)More flexible high-speed clock network; (16)Latch capability in Configurable Logic Blocks; (17)Input fast capture latch; (18)Optional mux or 2-input function generator on outputs; (19)12 mA or 24 mA output drive; (20)5V and 3.3V PCI compliant; (21)Enhanced Boundary Scan; (22)Express Mode configuration; (23)Chip scale packaging.

Diagrams